1. 2. 3. material content data sheet sales product name bts5482sf issued 29. august 2013 ma# MA001120934 package pg-dso-36-43 weight* 634.75 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 12.928 2.04 2.04 20367 20367 leadframe inorganic material phosphorus 7723-14-0 0.061 0.01 96 non noble metal zinc 7440-66-6 0.244 0.04 384 non noble metal iron 7439-89-6 4.881 0.77 7690 non noble metal copper 7440-50-8 198.190 31.22 32.04 312231 320401 wire noble metal gold 7440-57-5 0.883 0.14 1391 non noble metal aluminium 7429-90-5 2.770 0.44 0.58 4363 5754 encapsulation organic material carbon black 1333-86-4 0.807 0.13 1271 plastics epoxy resin - 57.685 9.09 90877 inorganic material silicondioxide 60676-86-0 344.897 54.32 63.54 543355 635503 leadfinish non noble metal tin 7440-31-5 5.006 0.79 0.79 7887 7887 plating noble metal silver 7440-22-4 3.335 0.53 0.53 5254 5254 glue plastics epoxy resin - 0.537 0.08 846 noble metal silver 7440-22-4 2.531 0.40 0.48 3988 4834 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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